发明名称 |
SOLID-STATE IMAGE PICKUP ELEMENT, METHOD OF MANUFACTURING THE SAME, AND IMAGE PICKUP APPARATUS INCLUDING THE SAME |
摘要 |
A solid-state image pickup element 1 is structured so as to include: a semiconductor layer 2 having a photodiode formed therein, photoelectric conversion being carried out in the photodiode; a first film 21 having negative fixed charges and formed on the semiconductor layer 2 in a region in which at least the photodiode is formed; and a second film 22 having the negative fixed charges, made of a material different from that of the first film 21 having the negative fixed charges, and formed on the first film 21 having the negative fixed charges.
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申请公布号 |
US2011031376(A1) |
申请公布日期 |
2011.02.10 |
申请号 |
US20100736569 |
申请日期 |
2010.03.02 |
申请人 |
SONY CORPORATION |
发明人 |
OSHIYAMA ITARU;HIYAMA SUSUMU |
分类号 |
H01L27/148;H01L21/339;H01L27/146;H01L31/10;H04N5/335;H04N5/361;H04N5/369 |
主分类号 |
H01L27/148 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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