发明名称
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a laser machining method and a laser machining apparatus capable of boring a hole without damaging a boring piece to be cut when boring a hole by laser beams. <P>SOLUTION: In the laser machining method and the laser machining apparatus, a workpiece W is irradiated with laser beams LB from a laser machining head 15, the laser machining head 15 is relatively moved with respect to the work to bore a hole surrounded by a closed curve 41. Laser machining is started from the inside or the outside of an area surrounded by the closed curved, and laser machining is performed along the closed curve from the arriving position S at which the laser machining head arrives along the closed curve 41. When the laser machining head 15 arrives again at the arriving position S, and the laser machining head 15 slightly passes through the arriving position S along the closed curve, the laser output is set to be substantially zero or zero, and the relative moving speed of the laser machining head 15 to the workpiece W is controlled in a non-stop state. <P>COPYRIGHT: (C)2006,JPO&NCIPI</p>
申请公布号 JP4628129(B2) 申请公布日期 2011.02.09
申请号 JP20050036618 申请日期 2005.02.14
申请人 发明人
分类号 B23K26/38;B23K26/08 主分类号 B23K26/38
代理机构 代理人
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