发明名称 |
Chip light emitting diode and fabrication method thereof |
摘要 |
A chip light emitting diode having a wide viewing angle, and a fabrication method thereof. The chip light emitting diode has a resin package sealing a light emitting chip which has at least one curved projecting part. The curved projecting part has a cross section which is substantially semicircular, or substantially or partially elliptical or parabolic. The curved projecting part preferably has a cross section which is comprised of a plurality of straight lines, an angle being formed between adjacent lines. The cross section is elongated to form a cylindrical outer surface of the resin package.
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申请公布号 |
USRE42112(E1) |
申请公布日期 |
2011.02.08 |
申请号 |
US20070652468 |
申请日期 |
2007.01.11 |
申请人 |
SEOUL SEMICONDUCTOR CO., LTD. |
发明人 |
HAN KWAN-YOUNG;KIM DO-HYUNG;YANG SEUNG-MAN;LEE CHUNG-HOON;KIM HONG-SAN;PARK KWANG-IL |
分类号 |
H01L29/22;H01L33/54;H01L27/15;H01L33/56;H01L33/62;H01L33/64 |
主分类号 |
H01L29/22 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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