| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a method for manufacturing a circuit board which has almost no degradation of a shock-absorbing material caused by a heating/pressing member while having excellent heat conductivity and high mounting accuracy and electrically connects a first connection terminal and a second connection terminal. <P>SOLUTION: The method for manufacturing a circuit board is configured as follows. A first circuit member, having a first connection terminal, and a second circuit member, having a second connection terminal, are arranged between a support and a heating/pressing member while making the first connection terminal and the second connection terminal face each other. An anisotropic conductive film is interposed between the first connection terminal and the second connection terminal. The heating/pressing member is heated/pressed so as to electrically connect the first connection terminal and the second connection terminal to each other. The method includes a step of executing heating/pressing by interposing a polyimide film, containing an aromatic polyimide or an alicyclic polyimide and having a glass transition temperature of 200-350°C, as a shock-absorbing material between the heating/pressing member and the first circuit member. <P>COPYRIGHT: (C)2011,JPO&INPIT</p> |
