| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a probe card capable of preventing misalignment of a bump from an electrode pad of a wafer in a wafer test where temperature change is required. <P>SOLUTION: The probe card includes a frame plate 1 having a plurality of through holes 3 corresponding to a semiconductor chip of the wafer, a wiring board 23, an anisotropic conductive film 5 having a size corresponding to the through hole 3 and being fixed on the through hole 3 or around the through hole 3 of the frame plate 1, and a contact point film 7 having a size corresponding to the through hole 3 and being fixed around the through hole 3 of the frame plate 1. The contact point film 7 includes a bump 17 arranged on the surface of an insulating film 15 and a conducting electrode 19 formed on the surface of the insulating film 15 and in the insulating film 15, and the bump 17 is electrically connected to a conducting path 11 of the anisotropic conductive film 5. <P>COPYRIGHT: (C)2011,JPO&INPIT</p> |
