A SUBSTRATE PAKAGE AND FABRICATING METHOD OF THE SAME

摘要

PURPOSE: A substrate package and a manufacturing method thereof are provided to improve the heat radiation performance of the substrate package by mounting an electronic device on an anode oxide metal substrate. CONSTITUTION: An anode oxide layer is formed on the surface of a metal plate(110). A circuit layer(130a) is formed on the anode oxide layer. A metal reflector(140) has a cavity which exposes an electronic device mounting area. The metal reflector is attached to the anode oxide metal substrate. An electronic device is mounted on the electronic device mounting area of the anode oxide metal substrate. An electronic device is connected to a circuit layer.