| 摘要 |
The invention can be used for improving performance of laser diodes, solar cells, microprocessors and other devices. The invention enables to create semiconductor devices and systems comprising several electronic components and having a great area of die, a great number of leads, high operating current and high heat dissipation. This is achieved by the following manner: offered leads are made of copper foil; the rigidity of the foil is decreased by means of creating of alternating narrow trenches and narrow through splits; the offered leads are microspring; additional improvement of performance can be achieved by the bending of inner leads along wide trenches. Offered leads can be directly connected to the dice.
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