| 摘要 |
<p>The invention relates to a method for manufacturing contactless portable objects with an integrated circuit. The method of the invention is characterized in that it comprises the steps of: providing a silicon wafer (1) having integrated circuits (2) comprising plates (7) for connecting said circuits by capacitive coupling to the contact terminals of an antenna conductor circuit (5) provided at the surface of a dielectric substrate (4) of the contactless object; cutting the integrated circuits from said silicon wafer; grasping the integrated circuits using a gripping means of an integrated circuit transfer machine; and transferring the grasped integrated circuits onto the dielectric substrate so that the plates of said circuits are positioned substantially opposite the contact terminals of the antenna circuits. The invention can particularly be used for manufacturing UHF RFID objects.</p> |
