LED WITH MOLDED REFLECTIVE SIDEWALL COATING

摘要

A sub mount wafer (36) having mounted on it an array of LED's (10) with a phosphor layer (30), is positioned with respect to a mould (40) having an array of indentions (42). A mixture (44) of silicone an 10%-50%, by weight TiO2, is dispensed between the wafer and the indentions, creating a moulded substantially reflective material. The moulded mixture forms a reflective wall (46) covering the sidewalls of the LED. The reflective material is than cured, and the sub mount wafer is separated from the mould such that the reflective material covering the sidewalls contain the light emitted from the LEO. The sub mount wafer is the diced. A piece (e.g., a reflector (50), support bracket (76), etc) may then be affixed to the sub mount (22) so that the LED protrudes through a centre hole (54) in the piece. The inner edge of the piece is easily formed do that it is located at any height above or below the top surface (32) of the LED.