| 摘要 |
PROBLEM TO BE SOLVED: To provide a surface analysis device capable of analyzing a state of a surface sample from the surface to a depth of submicrons, while cutting.SOLUTION: The surface analysis device is provided which includes a cutting blade for cutting the surface of a sample of which the surface is analyzed; a surface sample shaved off from the sample and a light source capable of irradiating the cutting blade with analysis light; a backup surface that is a surface, where the analysis light reaches after being applied to the surface sample and backs up the surface sample; and an optical path for making light pass from the surface sample. The surface analysis device can change the depth from the surface of the surface sample, by relatively moving the sample or the cutting blade. |
