| 摘要 |
PROBLEM TO BE SOLVED: To provide a curable resin composition having excellent heat resistance and achieving low thermal expansion and good solvent solubility, a cured product thereof, a printed wiring board made from the composition, a new epoxy resin achieving such properties, and a method for producing the new epoxy resin.SOLUTION: The curable resin composition contains, as essential components, an epoxy resin (A) represented by a compound having a backbone of formula (A1) (wherein Rs are independently a hydrogen atom, 1-4C hydrocarbon group or 1-2C alkoxy group) and having a naphthalene structure, a naphthalenon structure and a glycidyloxy group within its molecular structure, and a curing agent (B). |
