发明名称 MALE TERMINAL FITTING
摘要 PROBLEM TO BE SOLVED: To reduce a use volume of gold at gold plating.SOLUTION: A given length area positioned away from a tip of a tab part 11 is to be a contact area L with a female terminal fitting F, and a first gold-plated layer 13 is formed on the surface of the contact area L, while a second gold-plated layer 14 thinner than the first gold-plated layer 13 is to be formed at an area in front of the contact area L in the tab part 11. Thus, as the first gold-plated layer 13 with a given film thickness is formed at a part where electric conduction with the female terminal fitting F is necessary, durability unchanged from the prior art is maintained, and, as film thicknesses of gold-plated layers of other sites are lowered, a use volume of gold can be reduced.
申请公布号 JP2011018572(A) 申请公布日期 2011.01.27
申请号 JP20090162661 申请日期 2009.07.09
申请人 SUMITOMO WIRING SYST LTD 发明人 FUJII MASAYASU;TOBARI SATOSHI
分类号 H01R13/03;H01R13/04 主分类号 H01R13/03
代理机构 代理人
主权项
地址
您可能感兴趣的专利