发明名称 |
WIRING BOARD AND SEMICONDUCTOR DEVICE |
摘要 |
A wiring board includes a core substrate including an insulation base member; linear conductors configured to pierce from a first surface of the insulation base member to a second surface of the insulation base member; a ground wiring group including a first ground wiring formed on the first surface of the core substrate, and a belt-shaped second ground wiring formed on the second surface of the core substrate and electrically connected to the first ground wiring by way of a part of the linear conductors; and an electric power supply wiring group including a first electric power supply wiring formed on the first surface, and a second electric power supply wiring formed on the second surface and electrically connected to the first electric power supply wiring by way of a part of the plural linear conductors.
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申请公布号 |
US2011018144(A1) |
申请公布日期 |
2011.01.27 |
申请号 |
US20100813692 |
申请日期 |
2010.06.11 |
申请人 |
SHINKO ELECTRIC INDUSTRIES CO., LTD. |
发明人 |
HORIUCHI MICHIO;TOKUTAKE YASUE;MATSUDA YUICHI;YAMASAKI TOMOO;SAKAGUCHI YUTA |
分类号 |
H01L23/48;H05K1/00 |
主分类号 |
H01L23/48 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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