Method of backside emission analysis for BGA packaged IC's

摘要

A novel approach to detection of leakage site detection for BGA chips. The invention prevents damaging the semiconductor circuit that is a problem during conventional preparation for backside leakage detection for BGA chips. The invention teaches removing the backside from the BGA device and separating the BGA device into two parts. The back surface of the molded part within which the BGA chip is embedded remains undamaged within the scope of the present invention and can be electrically accessed to perform BGA die analysis.