| 发明名称 |
ROBUST METAL FILM ENCAPSULATION |
| 摘要 |
<p>The present invention relates to metal film encapsulation of an electrochemical device. The metal film encapsulation may provide contact tabs for the electrochemical device. The present invention may also include a selectively conductive bonding layer between a contact and a cell structure. The present invention may further include ways of providing heat and pressure resilience to the bonding layer and improving the robustness of the protection for the cell structure.</p> |
| 申请公布号 |
KR20110008095(A) |
申请公布日期 |
2011.01.25 |
| 申请号 |
KR20107026825 |
申请日期 |
2009.04.24 |
| 申请人 |
INFINITE POWER SOLUTIONS, INC. |
发明人 |
SNYDER SHAWN W.;BRANTNER PAUL C.;KEATING JOSEPH A.;BRADOW TIMOTHY N.;NARAYAN PRATIVADI B.;NEUDECKER BERND J. |
| 分类号 |
H01M2/26;H01M2/30 |
主分类号 |
H01M2/26 |
| 代理机构 |
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| 主权项 |
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