| 摘要 |
PROBLEM TO BE SOLVED: To provide a resin composition containing no halogen compound and having excellent flame-retardancy, heat resistance and metal foil peel strength; and to provide a prepreg, a metal foil-clad laminate, and a printed wiring board, using the composition.SOLUTION: The resin composition is prepared by including (a) a phosphinate of formula (1) or a diphosphinate of formula (2), (b) a thermosetting resin and (c) a curing agent for the thermosetting resin, as essential components. Wherein the particle of (a) the phosphinate expressed by formula (1) or the diphosphinate expressed by formula (2) has an average particle diameter of 2-7 micrometers, and the ratio of a major axis to minor axis (major axis/minor axis) of 1-3. |
