| 摘要 |
PROBLEM TO BE SOLVED: To provide a liquid resin composition for sealing which is used in a semiconductor element-mounted body, especially a flip chip-mounted body, etc., the bleeding of which is restrained, and which is excellent in pot life and fluidity.SOLUTION: The liquid resin composition for sealing includes (A) an epoxy resin, (B) a curing agent, (C) an inorganic filler and (D) a silicone-based copolymer, which is obtained by copolymerizing alkyl propeonate and polysiloxane alkyl propeoate. |
