| 摘要 |
PROBLEM TO BE SOLVED: To provide the uniform surface treatment of an object using a treatment solution while adequately controlling the concentration of components contained in the treatment solution.SOLUTION: An electroless plating apparatus 100 for executing the surface treatment of a wafer 13 by using a plating liquid includes a first densitometer 4 for detecting the concentration of components contained in the plating liquid circulating in a treatment tank 1 and a circulation line 3, a second densitometer 5 for detecting the concentration of components contained in a plating liquid at the different position from that of the first densitometer, and a control unit 14 for adjusting the flow rate of the plating liquid in the treatment tank 1 and the circulation line 3 so that the component concentration detected by the first densitometer 4 and the second densitometer 5 or the difference in the component concentrations reaches the predetermined target value. |
