| 摘要 |
PROBLEM TO BE SOLVED: To provide a mold release film which is excellent in adhesiveness between respective layers, particularly in shape followability to uneven portions, and has high reduction effect for bleeding of an adhesive at a coverlay opening part, and is more inexpensive.SOLUTION: A multilayer structure has an intermediate layer comprising a resin composition containing an ethylene-α-olefin copolymer resin (E) having a melting point of 50-110°C of 80-50 pts.mass, an epoxidized polyolefin resin (F) having a melting point of 50-110°C of 5-20 pts.mass, and a polybutylene terephthalate-based resin (G) having a bending elastic modulus of 600 MPa or less of 15-30 pts.mass with respect to the resin component of 100 pts.mass between two-layer mold release layers comprising a resin composition wherein a mass ratio of polybutylene terephthalate-based resin (A) obtained by copolymerizing a diol compound as a third component to a polymethylpentene resin (B) is 100:20 to 100:5. In the mold release film, the mold release layer:the intermediate layer=1:10 to 1:3, and the total thickness is 20-160 μm. |
