发明名称 COOLING DEVICE FOR A PLURALITY OF POWER MODULES
摘要 The invention relates to a cooling device for a plurality of power modules (16), comprising a heat-conducting body (15) through which a coolant flows. The cooling device comprises external cooling ribs (14) on a first housing shell of the body through which a coolant flows for receiving the plurality of power modules adjacent to each other. Each individual cooling rib is aligned to come into fixed heat-conducting contact on at least one upper or lower side of one of the plurality of power modules, and the housing shell, on the inner side in the region of the respective cooling rib(s), comprises means for the fluidic communication with the volume of the coolant in the inside the body through which the coolant flows.
申请公布号 EP2272311(A1) 申请公布日期 2011.01.12
申请号 EP20090737728 申请日期 2009.04.27
申请人 DANFOSS SILICON POWER GMBH 发明人 OLESEN, KLAUS KRISTEN;PAULSEN, LARS;KLINGHAGEN, JENS
分类号 H05K7/20;H01L23/46 主分类号 H05K7/20
代理机构 代理人
主权项
地址