发明名称 Manufacturing method of flash memory device comprising gate columns penetrating through a cell stack
摘要 A flash memory device includes a substrate, a cell stack having a semiconductor layer, in which junction areas for setting areas therebetween to channel areas are formed in a shape of a stripe, and an interlayer isolation layer for insulating the semiconductor layer, wherein the semiconductor layer and the interlayer isolation layer are repeatedly stacked. The flash memory device further includes an array of gate columns penetrating through the cell stack, perpendicular to the substrate and cutting through the junction areas to dispose the junction areas at both sides thereof, and a trap layered stack introduced into an interface between the gate column and the cell stack to store charge.
申请公布号 US7867831(B2) 申请公布日期 2011.01.11
申请号 US20080212819 申请日期 2008.09.18
申请人 HYNIX SEMICONDUCTOR INC. 发明人 SHIN HACK SEOB;PARK KYOUNG HWAN;HONG YOUNG OK;PARK YU JIN
分类号 H01L21/82 主分类号 H01L21/82
代理机构 代理人
主权项
地址