LOW COST BONDING TECHNIQUE FOR INTEGRATED CIRCUIT CHIPS AND PDMS STRUCTURES

摘要

Methods of bonding a structure fabricated in polydimethylsiloxane (PDMS) and an integrated circuit chip. The procedures for bonding include providing a substrate, affixing the integrated circuit to the substrate, as needed preparing the surface of the integrated circuit chip to permit bonding, aligning the PDMS structure and the features of the integrated circuit chip, and applying a bonding agent. The bonding agent is cured by exposure to a thermal regime for a suitable length of time. Depending on relative sizes, in some cases, a plural number of PDMS structures can be attached to one chip, or a single PDMS structure can be bonded to multiple chips. In some cases, the integrated circuit chip operates wirelessly. In other situations, the substrate provides electrical communication from the integrated circuit chip to electronic components.