| 摘要 |
PURPOSE: An overlay measuring method is provided to simplify the manufacturing process of semiconductor device and improve the yield rate without the investment or new technology. CONSTITUTION: An overlay vernier comprises the outside verniers(30a, 30b) and an inner side vernier(32). The overlay vernier comprises an alignment key, an overlay key, and all the measurable patterns. The overlay comprises the alignment, the overlay, and all the other pattern alignment. The opaque thin film comprises the metallic foil.
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