发明名称 SYSTEM FOR FILLING HOLES IN A PRINTED CIRCUIT BOARD WITH A FLUID FILL MATERIAL
摘要 There is a system for filling holes in a printed circuit board with a fluid fill material. The system receives a printed circuit board vertically within a main body. There is a dispensing head for selectively dispensing a fill material onto the vertically placed circuit board, the dispensing head having a plurality of holes. A feeding reservoir contains the fill material, and the feeding reservoir has a first end and a second end. An outlet system comprises a flow line connected to the first end of the feeding reservoir, and the flow line provides a flow path for the fill material from the first end of the feeding reservoir to the dispensing head. The flow line is attached to a manifold connected to the dispensing head, the manifold including connectors between the branches and with the absence of 90° elbows in the flow path. There is a plunger located at the second end of the feeding reservoir; and an air cylinder pushes the plunger into the feeding reservoir, thereby forcing the fill material out of the first end of the feeding reservoir, through the outlet system, and into the dispensing head.
申请公布号 US2010326566(A1) 申请公布日期 2010.12.30
申请号 US20090494235 申请日期 2009.06.29
申请人 TTM TECHNOLOGIES, INC. 发明人 HOHLFELDER TADD;MORAN BRAD;MATTHEWS RUBIN;GANNON THOMAS
分类号 H05K3/40;B65B1/04 主分类号 H05K3/40
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