发明名称 METHODS AND APPARATUS FOR A GROUNDING GASKET
摘要 <p>A conductive gasket includes a deformable contact region configured to provide compressive contact between the mounting surface of a connector (e.g., a right-angle micro-D connector) and a grounded surface of the substrate (e.g., PCB). A fastener region extends from the deformable contact region and is configured to align with a mounting region of the connector. A keep-out zone is provided adjacent to the deformable contact region and the fastener region and is configured to allow the pins of the connector to pass therethrough.</p>
申请公布号 WO2010151360(A1) 申请公布日期 2010.12.29
申请号 WO2010US30684 申请日期 2010.04.12
申请人 RAYTHEON COMPANY;FARMER, DANIEL, R. 发明人 FARMER, DANIEL, R.
分类号 H01R12/20 主分类号 H01R12/20
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