发明名称 |
Temperature measurement and control of wafer support in thermal processing chamber |
摘要 |
The present invention provides apparatus and methods for achieving uniform heating to a substrate during a rapid thermal process. More particularly, the present invention provides apparatus and methods for controlling the temperature of an edge ring supporting a substrate during a rapid thermal process to improve temperature uniformity across the substrate.
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申请公布号 |
US7860379(B2) |
申请公布日期 |
2010.12.28 |
申请号 |
US20070623238 |
申请日期 |
2007.01.15 |
申请人 |
APPLIED MATERIALS, INC. |
发明人 |
HUNTER AARON MUIR;ADAMS BRUCE E.;BEHDJAT MEHRAN;RAMANUJAM RAJESH S.;RANISH JOSEPH M. |
分类号 |
A21B2/00;A21B1/00;C23C16/00 |
主分类号 |
A21B2/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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