发明名称 |
Back-illuminated type solid-state image pickup device and camera module using the same |
摘要 |
The present invention provides a solid-state image pickup device including an image pickup pixel section which is provided on a semiconductor substrate and in which a plurality of pixels each having a photoelectric conversion element and a field-effect transistor are arranged, and a peripheral circuit section for the image pickup pixel section. An interconnect layer driving the field-effect transistor in the image pickup pixel section is formed on a first surface side of the semiconductor substrate. A light receiving surface of the photoelectric conversion element is located on a second surface side of the semiconductor substrate. The solid-state image pickup device includes a first terminal exposed from the second surface side of the semiconductor substrate, and a second terminal electrically connected to the first terminal and connectable to an external device on the first surface side of the semiconductor substrate.
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申请公布号 |
US7859073(B2) |
申请公布日期 |
2010.12.28 |
申请号 |
US20080166810 |
申请日期 |
2008.07.02 |
申请人 |
KABUSHIKI KAISHA TOSHIBA |
发明人 |
MATSUO MIE;KOHYAMA YUSUKE |
分类号 |
H01L31/0203;H01L27/14;H01L27/146;H04N5/335;H04N5/369;H04N5/374 |
主分类号 |
H01L31/0203 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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