| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for producing copper composite particles which can form a metal copper conductor of copper whose volume resistivity is suppressed, to provide a method for producing composite metal copper particles, to provide copper paste containing the copper composite particles or composite metal copper particles, and to provide a method for producing a metal copper conductor using the copper paste. SOLUTION: Regarding the copper composite particles, copper hydride fine particles in which the average particle diameter of the secondary particles is 20 to 350 nm are stuck to the surfaces of metal copper particles in which the average particle diameter of the primary average particle diameter is 1 to 20μm. The method for producing the copper composite particles includes: a step (I) where, from a solution in which a water soluble copper compound is dissolved and a reducing agent, a reaction system to produce a copper hydride fine particle in which the secondary particle diameter is 20 to 350 nm is formed; a step (II) where, into the reaction system, metal copper particles in which the average particle diameter of the primary particles is 1 to 20μm are made to exist, copper composite particles in which the copper hydride fine particles are stuck to the surfaces of the metal copper particles are produced and, on the surfaces of the metal copper particles, copper composite particles in which copper hydride fine particles are stuck are formed; and a step (III) where the copper composite particles are separated from the reaction system are performed so as to obtain the objective copper composite particles. COPYRIGHT: (C)2011,JPO&INPIT
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