| 摘要 |
<p>PURPOSE: A stacked wafer level package and a method for manufacturing the same are provided to reduce a cost for manufacturing the package by performing both a stacking process for semiconductor chips and a packaging process on a wafer. CONSTITUTION: An external connection unit is arranged in the lower part of a rearranged wiring layer(111). A chip connection pad(130a) is arranged on the upper part of the rearranged wiring layer. A semiconductor chip(160) is mounted on the rearranged wiring layer. A metal post(140) is electrically connected to the rearranged wiring layer. A sealing unit(170) hermetically seals the semiconductor chip. Electronic components(200) are electrically connected to the metal post.</p> |
