发明名称 COMPOSITION FOR POLYIMIDE RESIN
摘要 PROBLEM TO BE SOLVED: To provide a composition for polyimide resin which has high transparency, and is suppressed in yellowing and excellent in heat resistance, and which also exhibits excellent mechanical properties and adhesivity when it is formed into a thin film; to provide a polyimide resin composition obtained by reacting the composition; to provide a polyimide film being a sheet-like formed article of the resin composition; and to provide an adhesive formed from the film, a photosensitive base material, and a method for producing the resin composition. SOLUTION: The composition for polyimide resin contains metal oxide fine particles which are treated with a surface treatment agent containing an anhydride of carboxylic acid compound, a diamine compound and a tri-functional alkoxy silane represented by formula (I) (wherein, R<SP>1</SP>is a substituent containing an epoxy structure; R<SP>2</SP>, R<SP>3</SP>and R<SP>4</SP>are each independently a straight or branched chain 1C-4C alkyl group). COPYRIGHT: (C)2011,JPO&INPIT
申请公布号 JP2010280807(A) 申请公布日期 2010.12.16
申请号 JP20090135013 申请日期 2009.06.04
申请人 NITTO DENKO CORP 发明人 HIRANO KEISUKE
分类号 C08L79/08;C08K9/06 主分类号 C08L79/08
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