| 摘要 |
In one aspect, an embodiment of an IC package includes an IC chip electrically connected to a substrate, a heatspreader disposed over the IC chip, wherein the heatspreader does not directly contact the IC chip, and an encapsulant material encapsulating at least a portion of the IC chip and a portion of the heatspreader such that a top portion of the heatspreader is exposed to the surroundings of the IC package. In another embodiment, the heatspreader comprises at least one castellation to improve adhesion to the encapsulation compound. A method of manufacturing such IC package is also disclosed.
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