发明名称 POLISHING RATE CORRECTION METHOD FOR SURFACE PLATE, POLISHING RATE CORRECTION SYSTEM, AND METHOD OF MANUFACTURING MAGNETIC HEAD
摘要 <P>PROBLEM TO BE SOLVED: To provide technology making a polishing rate of a surface plate uniform. <P>SOLUTION: In production of a polishing surface plate used for final floating surface polishing working of a manufacturing step of a magnetic head, the polishing rate correction system for previously measuring the polishing rate distribution in the polishing surface of the polishing surface plate and performing correction of the polishing rate according to the measured distribution of the polishing rate is provided. The polishing rate correction system 700 includes a conditioning device 20 descending the polishing rate at a position where the polishing rate is larger than a predetermined value; a dressing device 30 for ascending the polishing rate at a position where the polishing rate is smaller than a predetermined value; and the polishing rate correction device 700 for controlling both devices by detecting the distribution of the polishing rate. <P>COPYRIGHT: (C)2011,JPO&INPIT
申请公布号 JP2010280047(A) 申请公布日期 2010.12.16
申请号 JP20090136625 申请日期 2009.06.05
申请人 HITACHI LTD 发明人 KOJIMA HIROYUKI;SASAKI SHINJI;FUKUOKA NOBUHIKO
分类号 B24B37/00;B24B53/00;B24B53/017;B24B53/02;G11B5/31;G11B5/39 主分类号 B24B37/00
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