发明名称 |
Fixed Jig, Chip Pickup Method and Chip Pickup Apparatus |
摘要 |
It is an object to provide a fixing jig which can unmovably suction a chip group produced by segmenting a semiconductor wafer into pieces, and can suction one chip by detaching the chip selectively and reliably from the chip group. A fixing jig 3 is composed of a jig base 30 and an contact layer 31. A concave part 2 is formed on one side of the jig base 30. The concave part 2 is sectioned into small chambers 15 by a partition 12 having a height almost equivalent to that of a sidewall 35. The contact layer 31 is disposed on the upper edge of the sidewall 35 and the partition 12 for covering the concave part 2. A through hole 17 that is communicated with the outside is formed in each small chamber 15.
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申请公布号 |
US2010314894(A1) |
申请公布日期 |
2010.12.16 |
申请号 |
US20070445697 |
申请日期 |
2007.10.12 |
申请人 |
LINTEC CORPORATION |
发明人 |
WATANABE KENICHI;SEGAWA TAKESHI;FUJIMOTO HIRONOBU |
分类号 |
H01L21/67;B25J15/06;B66C1/02;F16M13/00;H01L21/683 |
主分类号 |
H01L21/67 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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