| 摘要 |
A CIRCUIT MEMBER INCLUDES A FRAME SUBSTRATE (2) FORMED, BY PATTERNING A ROLLED COPPER PLATE OR A ROLLED COPPER ALLOY PLATE, WITH A DIE PAD PORTION (3) FOR A SEMICONDUCTOR CHIP (11) TO BE MOUNTED THEREON, AND A LEAD PORTION (8) FOR AN ELECTRICAL CONNECTION TO THE SEMICONDUCTOR CHIP, HAVING ROUGH SURFACES FORMED AS ROUGHED SURFACES ON UPSIDES AND LATERAL WALL SIDES OF THE DIE PAD PORTION AND THE LEAD PORTION, AND SMOOTH SURFACES FORMED ON DOWNSIDES OF THE DIE PAD PORTION AND THE LEAD PORTION, AND THE DIE PAD PORTION AND THE LEAD PORTION ARE BURIED IN A SEALING RESIN (15), HAVING A DOWNSIDE OF THE LEAD PORTION EXPOSED. (FIGURE 9) |
