| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide an electrical inspection substrate having a sufficient dimensional accuracy as to a connection to a pad on a silicon wafer and capable of connecting the pad on the silicone wafer and connection terminals formed on the substrate without a poor connection even in a test and so on exposed to a big temperature difference, and a method of manufacturing the same. <P>SOLUTION: The electrical inspection substrate 1 includes a multilayer ceramic substrate 4 having mullite and borosilicate glass as major ceramic components. The multilayer ceramic substrate 4 contains an alkali metal oxide in the borosilicate glass by 0.5 to 1.5 mass%. An average thermal expansion coefficient is 3.0 to 4.0 ppm/°C at -50°C to 150°C, and there is a relationship of 0 ppm/°C<(α1-α2)≤2.5 ppm/°C between the thermal expansion coefficientα1 at each temperature of -50°C to 150°C and the thermal expansion coefficientα2 of the silicon wafer at the same temperature. <P>COPYRIGHT: (C)2011,JPO&INPIT</p> |
