| 摘要 |
PURPOSE: An apparatus and a method for treating a substrate are provided to uniformly process the overall surface of the substrate by uniformly generating shearing stress across the substrate. CONSTITUTION: A work processing part(100) implements fabrication processing for a substrate(W). The work processing part comprises a processing chamber(110), a driving member(120), and a substrate support member(130). A solution supplier(200) supplies a solution for processing the substrate to the work processing part.
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