| 摘要 |
The invention relates to cooling techniques for portable devices such as, for example, mobile telephones. In one implementation, a portable device comprises one or more printed circuit boards (“PCBs”) supporting multiple heat-generating components, an airflow generator adapted to generate an airflow internally in the portable device, and a heat sink element thermally connected to the heat-generating components, wherein the heat sink element is adapted to receive heat from the heat-generating components for dissipation by the airflow.
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