| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a photocurable thermosetting resin composition which can form a cured film having PCT durability, HAST durability, electroless gold plating durability, and cold-heat shock resistance, which are important as a solder resist for a semiconductor package, and to provide a dry film and a cured product of the composition, and a printed wiring board having a cured film such as a solder resist of the composition formed thereon. <P>SOLUTION: The photocurable thermosetting resin composition is developable with an alkali aqueous solution and includes: (A) a carboxyl group-containing resin (excepting a carboxyl group-containing resin derived from an epoxy resin as a start material); (B) a photopolymerization initiator; and (C) a hydroxyl group-containing elastomer. Preferably, the composition further includes (D) a thermosetting component, and preferably further includes (G) a colorant. Preferably, the carboxyl group-containing resin does not contain a hydroxyl group, and more preferably, the resin further includes a photosensitive group. The hydroxyl group-containing elastomer is preferably butadiene or an isoprene derivative. <P>COPYRIGHT: (C)2011,JPO&INPIT |
