| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method where copper is satisfactorily packed into a non-through hole present on a substrate, having an aspect ratio (depth/opening diameter) of ≥5 and subjected to conduction treatment in a short time. <P>SOLUTION: In the method for packing copper, regarding a method where copper is packed into a non-through hole present on a substrate, having an aspect ratio (depth/opening diameter) of ≥5 and subjected to conduction treatment, as an acidic copper plating bath, using an acidic copper plating bath comprising a water soluble copper salt, sulfuric acid chlorine ions, a brightener and a copolymer of diallylamines and sulfur dioxide, periodic current inversion copper plating is performed, so as to pack copper into the non-through hole. <P>COPYRIGHT: (C)2011,JPO&INPIT |
