| 摘要 |
PROBLEM TO BE SOLVED: To evenly apply pressure throughout a plurality of laminated printed wiring boards, in a manufacturing process of a laminated printed wiring board. SOLUTION: A plurality of single-layer printed boards 38 becoming a single laminated printed wiring board 46 are laminated on a mounting board 40. The mounting board 40 and the laminated single-layer printed boards 38 are integrated and inserted into a bag body 32, and the bag body is sealed with a mouth ring 42. A plurality of the bag bodies 32 each having the single-layer printed boards 38 and the mounting board 40 housed therein are entered in a pressure vessel of an isotropic pressurizing device, and heated and pressurized through a fluid. Since each set of the plurality of single-layer printed boards becoming the single laminated printed wiring board are housed in the bag body in the laminated state, pressure can be evenly applied even when the upper face of the single-layer printed wiring board has unevenness. Mass productivity is secured by pressurizing the respective printed wiring boards housed in the plurality of bag bodies at the same time. COPYRIGHT: (C)2011,JPO&INPIT |
