| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a power module which prevents a decrease in insulation owing to moisture absorption and has improved long-period reliability. <P>SOLUTION: The power module includes a metal plate 1, an insulating resin substrate 2 arranged on the metal plate, wiring 3 arranged on the insulating resin substrate, a semiconductor chip 4 mounted on the wiring, and a sealing resin 5 sealing the metal plate, insulating resin substrate, wiring, and semiconductor chip, wherein a low moisture-permeable coating layer 7 made of a resin having lower moisture vapor transmission than that of the sealing resin is provided between the insulating resin substrate and the sealing resin. The low moisture-permeable coating layer 7 is provided extending to a part 1a of a side face of the metal plate which comes into contact with the sealing resin to improve moisture resistance more. <P>COPYRIGHT: (C)2011,JPO&INPIT</p> |
