METHOD FOR MANUFACTURING A LIGHT-EMITTING DIODE UNIT, AND LIGHT-EMITTING DIODE UNIT MANUFACTURED BY THE METHOD

摘要

The present invention provides a method for manufacturing a light-emitting diode unit, comprising: a first process of preparing a lower substrate in which an upper thermally conductive film having superior thermal conductivity is formed at the center of the upper surface of a lower insulation substrate, a positive wiring pattern and a negative wiring pattern are formed at the upper surface of the lower insulation substrate such that the positive wiring pattern and the negative wiring pattern avoid contact with the upper thermally conductive film, and a lower thermally conductive film having superior thermal conductivity is formed at a lower surface of the lower insulation substrate; a second process of mounting a light-emitting diode chip on the upper thermally conductive film of the lower substrate; and a third process of electrically connecting an N-type pad and a P-type pad of the light-emitting diode chip to the positive wiring pattern and to the negative wiring pattern.