A METHOD FOR MANUFACTURING A TEMPLATE FOR FORMING SOLDER BUMP

摘要

PURPOSE: A method for manufacturing a template for forming a solder bump is provided to reduce manufacturing costs of the solder bump by using one template several times. CONSTITUTION: A base layer with a plurality of receiving grooves is made on one side of a plane(S10). A coating layer is formed on one side of the base layer with the plurality of receiving grooves(S20). A solder bump is formed on the substrate by heating a base layer when the substrate is closely adhered to the receiving grooves filled with solder(S30). A coating layer is formed on the base layer with the coating layer again(S50).