发明名称 MANUFACTURING METHOD OF SOI SUBSTRATE
摘要 An SOI substrate is manufactured by a method in which a first insulating film is formed over a first substrate over which a plurality of first single crystal semiconductor films is formed; the first insulating film is planarized; heat treatment is performed on a single crystal semiconductor substrate attached to the first insulating film; a second single crystal semiconductor film is formed; a third single crystal semiconductor film is formed using the first single crystal semiconductor films and the second single crystal semiconductor films as seed layers; a fragile layer is formed by introducing ions into the third single crystal semiconductor film; a second insulating film is formed over the third single crystal semiconductor film; heat treatment is performed on a second substrate superposed on the second insulating film; and a part of the third single crystal semiconductor film is fixed to the second substrate.
申请公布号 US2010291755(A1) 申请公布日期 2010.11.18
申请号 US20100844856 申请日期 2010.07.28
申请人 SEMICONDUCTOR ENERGY LABORATORY CO., LTD. 发明人 ISAKA FUMITO;KATO SHO;NEI KOSEI;KOMATSU RYU;MIZOI TATSUYA;SHIMOMURA AKIHISA
分类号 H01L21/762 主分类号 H01L21/762
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