EJECTING DEVICE OF SEMICONDUCTOR DIE AND METHOD THEREOF

摘要

PURPOSE: An ejecting device of semiconductor die and a method thereof are provided to prevent the cracking phenomenon of a semiconductor die by distributing the force applied to the semiconductor die by applying the horizontal direction and vertical direction at the same time. CONSTITUTION: A center pusher(120) is combined to the through-hole of a main body(110). A base(130) is combined on the top of the center pusher in the form of the board. A center block(140) is combined to the center of the base. A guide rail(150) is combined to the base. A finger(160) is combined movably according to the guide rail in the horizontal direction.