Phenolic OH and radically polymerizable group containing polyimide silicone and epoxy resin

摘要

A heat-curable resin composition, comprising (A) a polyimide silicone resin having a phenolic hydroxyl group and a radically polymerizable group bonded to a silicon atom, (B) an epoxy resin in such an amount that a molar ratio of the epoxy groups of the epoxy resin to the phenolic hydroxyl groups of the polyimide silicone resin (A) ranges from 0.2 to 10, and a catalytic amount of (C) an organic peroxide.