发明名称 Adhesive tape cutting method and apparatus using the same
摘要 A strip-shaped supporting adhesive tape is joined to a ring frame, and then is stuck with a cutter blade such that the cutter blade penetrates the adhesive tape. In a state where a cutting edge of the cutter blade is brought into contact with a tape joined side of the ring frame, thereafter, the adhesive tape is cut along a contour of the ring frame while electric current is fed to each of the cutter blade and the ring frame. Herein, a sensor monitors a conduction status in real time.
申请公布号 US7833367(B2) 申请公布日期 2010.11.16
申请号 US20070907429 申请日期 2007.10.12
申请人 NITTO DENKO CORPORATION 发明人 YAMAMOTO MASAYUKI;IRIE MASARU
分类号 B32B38/04 主分类号 B32B38/04
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