| 发明名称 |
CURING ACCELERATOR, EPOXY RESIN COMPOSITION, AND SEMICONDUCTOR DEVICE |
| 摘要 |
<p>A CURING ACCELERATOR WHICH IS SUI TABLE FOR VARIOUS CURABLE RESIN COMPOSITIONS, AN EPOXY RESIN COMPOSITION HAVING EXCELLENT CURABILITY, STORAGE STABILITY AND FLUIDITY, AND A SEMICONDUCTOR DEVICE HAVING EXCELLENT SOLDER CRACKING RESISTANCE AND MOISTURE RESISTANCE RELIABILITY ARE PROVIDED. THE EPOXY RESIN COMPOSITION INCLUDES A COMPOUND (A) HAVING TWO OR MORE EPOXY GROUPS IN ONE MOLECULE, A COMPOUND (B) HAVING TWO OR MORE PHENOLIC HYDROXYL GROUPS IN ONE MOLECULE, TRISUBSTITUTED PHOSPHONIOPHENOLATE OR A SALT THEREOF AS A CURING ACCELERATOR (E), AND AN INORGANIC FILLER (D).</p> |
| 申请公布号 |
MY142243(A) |
申请公布日期 |
2010.11.15 |
| 申请号 |
MY2003PI02108 |
申请日期 |
2003.06.05 |
| 申请人 |
SUMITOMO BAKELITE COMPANY LIMITED |
发明人 |
AKIKO OKUBO;YOSHIYUKI GOH;YOSHIHITO AKIYAMA;HIROSHI HIROSE;HIROTAKA NONAKA;MAKI SUGAWRA |
| 分类号 |
B01J27/16;C08G59/68;C07F9/54;C08G59/20;C08G59/62;C08K5/50;C08L63/00;C08L85/00;H01L23/29;H01L23/31 |
主分类号 |
B01J27/16 |
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