| 摘要 |
PROBLEM TO BE SOLVED: To provide a molding apparatus of a resin molding, an apparatus that hardly causes what they call shrinks, cracks or voids (bubbles) in the resin molding and that has an extremely simple structure. SOLUTION: In the molding apparatus of a resin molding, resin 4 is injected in the inner cavity 3 of a molding die A in which an upper die 1 and a lower die 2 form the inner cavity 3 and, after the resin 4 is cured by setting and heating the molding die A in a curing furnace B, a resin molding inside the molding die A is taken out. In this molding apparatus, an insulating layer 5 is installed on the outer surface of one molding die, either the upper die 1 or the lower die 2, in the curing furnace B, with a temperature difference produced between the upper die 1 and the lower die 2. In particular, in the case of molding a bowl-shaped resin molding with the molding die A, the insulating layer 5 is installed on the projected outer surface of the upper die 1. COPYRIGHT: (C)2011,JPO&INPIT
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