发明名称 |
PANELIZED BACKSIDE PROCESSING FOR THIN SEMICONDUCTORS |
摘要 |
A semiconductor manufacturing method includes attaching a first die to a substrate panel. The method also includes applying a mold compound after attaching the first die to the substrate panel to the first die and the substrate panel. The method further includes thinning the first die and the mold compound after applying the mold compound. Attaching the die to the substrate panel before thinning eliminates usage of a carrier wafer when processing thin semiconductors. |
申请公布号 |
WO2010129903(A1) |
申请公布日期 |
2010.11.11 |
申请号 |
WO2010US34096 |
申请日期 |
2010.05.07 |
申请人 |
QUALCOMM INCORPORATED;CHANDRASEKARAN, ARVIND |
发明人 |
CHANDRASEKARAN, ARVIND |
分类号 |
H01L25/065;H01L23/48 |
主分类号 |
H01L25/065 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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